Maximum freedom with regard to PCB design calls for flexible terminal solutions that can also establish secure contacts with composite PCBs made from glass, ceramic or aluminium.
With our new LSF-SMD family, we are satisfying demands for fully-automatic PCB surface installation using the SMD soldering procedure. Two soldering pads per pole provide a high level of mechanical stability according to IPC A 610 Class 2. A reliable connection is established without tools thanks to “PUSH IN” direct connectivity.
The 3.50, 5.00 and 7.50 mm pitches and the 90°, 135° and 180° conductor outlet directions cover a multitude of device requirements and offer high component density with a maximum connection cross-section of 1.5 mm². Use of the distortion-free insulating material LCP, which is resistant to high temperatures and has a moisture level of MSL 1, enables a high level of dimensional stability, thus guaranteeing co-planarity for the reflow soldering process without the need for a drying phase beforehand.
Drilled holes and feed-throughs on PCBs cost time, take up space and compromise the freedom of developers. Our wide SMD range featuring “PUSH IN” direct connectivity is economical and opens up new design possibilities. For LED devices featuring an aluminium cooling element, for instance, where no holes can be drilled.
Fast wire connection method
The proven “PUSH IN” direct connectivity enables secure contacts up to 1.5 mm² without the need for tools. Conductors can be released simply and quickly by pressing the release button.
Automatic assembly is supported by the tape-on-reel packaging in standard belt widths. Pick-and-Place pads guarantee reliable attaching and setting down.
Stable soldering connections
Featuring two soldering pads per pole, LSF-SMD PCB terminals satisfy the most stringent mechanical fixing requirements without the need for additional mounting flanges.
Use of the LCP insulating material means that assembly can take place directly during the SMT process without the need for pre-drying. There is no risk of blisters forming.
Product overview 2014