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Depending on the requirements and area of use, we’ll offer you the connection system you need. Gather full details on our range of wire connection systems and convince yourself of the benefit to the customer.
Due to the unique "mousetrap principle," the SNAP IN connector connects in record time. Handling is as simple as the principle itself: The stripped conductor is plugged directly into an open connection point, and with a click, the snap-in connection snaps into place. The reverse is just as quick: Press the pusher and the connection point re-opens.
The innovative universal connector for any type of application. Both in manual processing and in fully automated wiring processes, different types of conductors can be reliably connected either without or with ferrules.
The stripped or prepared wire is simply pushed into the terminal point as far as it will go and the connection is finished. Operating the release lever is only required with flexible wires or to release the connection. The stainless steel spring ensures a high contact force between wire and the tinned copper busbar. A stainless steel cage enclosure prevents subsidence in the contact area. To prevent any drop in clamping force plastic parts were deliberately not used.
The default choice for operation in the field; it permits speedy wiring and, combined with its small size, its intuitive use is also advantageous even in environments with severe vibration.
Steel clamping-yokes made by using a stamping and bending process guarantee a vibration proof clamp connection. When the screw on the clamp is tightened, there is a counter effect in the clamping yoke’s threaded area which prevents the connection accidentally loosening. As the screw thread is on an inclined plane, there is a force gain created and a very high clamping force is achieved. Weidmüller uses hardened steel with optimal corrosion protection for stability and security and copper alloys in the contact area for good electrical conductivity.
The standard connection for applications in industrial environments with the highest requirements for reliability even under harsh conditions.
The connection produces the greatest possible packing density in the terminal area. The ”pull effect“ ensures that the connected wire is pulled in to the clamping point producing a secure contact.
Housing design or installation requirements such as PCB slots, that do not allow a right angled screw operation for reasons of space.
The crimp contacts can be attached using hand tools or with a crimping machine for producing large batches. The contacts are then locked into the housing provided. For fully automated processing, taped crimp contacts are available.
Applications that combine fully automatic and factory oriented processing steps with the actual field wiring. Works in environments with severe vibration or temperature fluctuations.
Take advantage of our specialist knowledge and expertise, inform yourself about the intended use of ferrules with plastic collars.
PCB plug-in connectors are not standardized, they are manufactured and tested along the lines of the current standards.
|PCB terminals||EN 60947-7-1||DIN EN 60947-7-1 / VDE 0611||IEC 60947-7-1|
|EN 61984||DIN EN 61984 / VDE 0627||IEC 61984|
|DIN IEC 60512||IEC 60512|
|Not standardized PCB connectors||EN 61984||DIN EN 61984 / VDE 0627||IEC 61984|
|DIN IEC 60512||IEC 60512|
|Feed through terminals||EN 60947-7-1||DIN EN 60947-7-1 / VDE 0611||IEC 60947-7-1|
Types of connection
|Screw connection||EN 60999||DIN EN 60999 / VDE 0609||IEC 60999|
|Screwless connection||EN 60999||DIN EN 60999 / VDE 0609||IEC 60999|
|Crimp connection||EN 60352-2||DIN EN 60352-2||IEC 60352-2|
|Solder connection||HD 3126.96.36.199S3||DIN IEC 60068-2-20||IEC 60068-2-20|
|Wire wrap connection||EN 60352-1||DIN EN 60352-1||IEC 60352-1|
|IDC connection||EN 60352-4||DIN EN 60352-4||IEC 60352-4|
Electronic subassemblies are manufactured economically using surface-mount technology (SMT) with surface-mount devices (SMD). Design measures such as co-planarity and the size/shape of the soldering pads lend electromechanical components a reliable and stable printed-circuit board connection. The structural shape and temperature stability of Weidmüller SMD components are matched to processing in automated surface mounting equipment.
Subassemblies that are exclusively equipped with SMD components and exposed to medium electromechanical loads.
Wave soldered products in THT (Through Hole Technology), also known as pin-in-hole, is the best alternative to SMT (Surface Mount Technology) if higher forces can act on electromagnetic PCB components. The component design of Weidmüller products is specifically developed for this application and takes into account the requirements in terms of design types and processing from the beginning.
Wired (THT) PCB plug-in connectors and terminal blocks are processed in wave soldering. The pins of the component are pushed into the through-holes and are then run through one or more solder waves. When applying the solder to the solder pin, the fluid solder is drawn into the through-holes by the wetting and capillary forces and forms the solder joint.
Reflow products in THT (through-hole technology) are the best alternative to using just SMT (surface-mount technology) if higher forces might be operating on the printed-circuit board components. The component design of Weidmüller products is specifically developed for this application and takes into account the requirements in terms of structural shape, temperature stability, and processing for THT products from the word “go.”
Applications where fast processing and reliable and stable connections to the printed-circuit board are of the essence. Reflow, wave, or hand soldering with high temperature requirements.
All the metals used by Weidmüller are selected and processed with their surfaces treated according to the latest technical standards, and are compliant with the RoHS (Restriction of Hazardous Substances) EU Directive.
Steel parts are electrogalvanized and treated with an additional passivation technique. The surface protection conforms to the highest standards, is matched to the special requirements of the connection systems used and is RoHS-compatible. Experience gained from storage in outdoor test racks at different locations (industrial, marine, tropical, and normal atmospheres) has been incorporated into the design of the surface protection.
The current-carrying materials copper, brass, and bronze are characterized by a high conductivity plus good mechanical properties. The surfaces are usually given a coating of tin, which creates an extremely good, “malleable” contact with a low contact resistance. Apart from ensuring consistently good electrical properties, the tin coating provides excellent protection against corrosion. Solder connections are also given a coating of tin. In order to guarantee the long-term solderability (shelf life), the brass parts are given an additional nickel coating as a diffusion barrier. The nickel coating provides effective protection against the loss of zinc atoms from the brass.
The heart of a connector is its contacts. They make up the actual detachable connection. Two types of contacts make this possible: male and female connectors. The pin conducts the electrical connection along its outer surface. It is inserted into the socket, which conducts the electrical connection along the surface of its interior side. The contacts on OMNIMATE plug-in connectors consist of copper alloys. The contact surfaces have different galvanic coatings according to the operating conditions.
Tin-plated contact surfaces are the standard surfaces for OMNIMATE plug-in connectors at Weidmüller. These surfaces are ideally suited for normal operating conditions in the industrial environment, while high contact forces and the relatively low degree of hardness of the surface material ensure low contact resistances. Tin-plated contact surfaces are suitable for transmitting higher currents and voltages (>100 mV and >100 mA) and for low plugging cycles.
Gold-plated contact surfaces are more resistant against climatic, corrosive and especially mechanical stress conditions. The latter mainly occur as a result of vibrations or high plugging cycles. Gold surfaces have the best properties for transmitting low currents and voltages (<100 mV and <3 mA).
Due to its high conductivity, silver is excellently suited to high current applications. OMNIMATE Power products come equipped with silver-plated contact surfaces, depending on their performance class.
Insulating materials In order to do justice to the different requirements placed on our products, it is necessary to use various insulating materials tailored to the particular application. None of the insulating materials used by Weidmüller contain any hazardous substances. Above all, we ensure that all our materials are free of cadmium. They contain no color pigments based on heavy metals and do not lead to the formation of dioxin or furan.
Every new design needs different components to provide a suitable solution for your application. For example, the mating connectors on the PCB and in the housing have to meet different requirements. When installing the mating connectors, your customers will expect enhanced features for safety and convenience.
Find the best connectors for your project.
This simplest connector version has no side panels. Open variants can be positioned next to one another without a loss of poles (end-stackable). Two 2-pole connectors can therefore be used to produce one 4-pole connector on the printed circuit board. The end-stackable design is flexible when producing very large numbers of poles on the printed circuit board.
Closed versions are used to prevent the plug being incorrectly inserted and to provide better dust protection. Ideally suited to prevent mismating.
The dovetail variant is closed and allows mounted blocks to be added. Our mounting options deliver all the flexibility you require.
For the classic screw option, each flange is paired with a nut for the screw in the flange plug counterpart.
If you only want to link connectors and plugs with a release latch and don’t want to fix them with a screw, this is the best solution. The clip-on flange provides the plug’s latching hook, with the contour needed to ensure a secure fix, which is easy to release later on.
For some OMNIMATE® Power series, alongside the classic flange versions located externally on the right and left of the male and female connectors, we also provide an innovative middle flange with a latching hook mechanism. This clever solution makes very simple and safe handling possible. The pin and plug can be securely fixed and released with just one hand. As an option, the clip-on flange, with an extra nut in the male connector, can also be screwed down to the plug. Variants with a solder pin for additional fixing on the printed circuit board are also possible.
For increased mechanical stability, you can also use a screw to fasten the flange connector to the PCB. An extra hole must be provided on the printed circuit board for the screws.
Solder flange rather than screw. For increased mechanical stability on the printed circuit board, an additional solder pin is integrated into the flange sides on the printed circuit board. This pin can be simply soldered during the soldering process. There is no need for any more screw connections.
The standard version—without additional flange or latch. To release, simply pull the plug. In most series, the plugs can be plugged next to one another, without a loss of poles.
The variant with a dovetail contour on the left and right is closed and if necessary, you can mount extra small fastening blocks (flanges) for installation. With little effort, you can therefore prepare versions which are both closed and feature a flange.
Plugs with flange have a screw on either end. This ensures secure fixing of the plug with the matching connector, with flange and nut. Increased safety means that no one can release the plug by mistake. In our OMNIMATE Power series, a latching hook provides secure retention. The screw can also be used for fastening purposes. The latch between the plug and pin can be released by simply pressing on both sides.
There is a lever on the right and left of the plug which can be easily moved by pressing with a screwdriver or fingers. Plug and pin are also automatically linked with just one click. Because of the lock mechanism, the plug cannot be released by mistake. Pulling forces are increased, for connectors with large numbers of pins in particular. However the release latch can be used to simply release the plug from the connector with flange, or from the housing without the wires having to be pulled. The plug can only be released from the pin by manually unlocking the release catch at the same time.
For some OMNIMATE® Power series, alongside the classic flange versions located on the right and left of the male and female plugs, we also provide an innovative middle flange. This clever solution makes very simple and safe handling possible. The pin and plug can be securely fixed and released with just one hand. To fix the components, either simply latch together or, for increased safety, you can also insert a screw through the latching hook.
Surface Mount Technology (SMT) has become established as the common standard for processing electronic assemblies. The connection system can be integrated in the SMT process in two ways: by means of THR (Through-Hole Reflow) or SMD (Surface Mount Device) technology. A combination of both types of mounting is also possible.
Find out more about our THR and SMD components in the following.
In the through-hole reflow process (THR), components are inserted through a hole in the PCB and then soldered to other SMT components. The special challenge of this method is that the components need to withstand the high temperatures of the SMT process.
With their short pin length of 1.50 mm, our components free up more space and allow greater design freedom, while meeting the requirements of IPC-A-610 E (7.3.3, Table 7-3, Note 1). With a PCB thickness of 1.60 mm, you benefit from double-sided assembly.
The option of vapor-phase soldering is also available, since no drops of solder paste form on the underside of the circuit board. Our simplified paste application process and minimized paste volumes also reduce your manufacturing costs. The optimum temperature absorption and trouble-free degassing of the flux in the soldering process also contribute to cost-efficient PCB assembly.
We manufacture our THR components from the high-performance plastic LCP to ensure reliable, problem-free use on your printed circuit boards. You can use these halogen-free, high-temperature-resistant components in all common soldering methods and benefit from their outstanding dimensional stability and accurate grid alignment. With their extremely low moisture sensitivity level (MSL 1), you can store the components indefinitely and use them in the assembly process without pre-drying. Our components remain dimensionally stable even at high operating temperatures and fit snugly on the PCB.
With a position tolerance of less than ± 0.1 mm around the zero position, our solder pins exceed the requirements of the IEC 61760-3 standard. Due to our advanced manufacturing methods, our high-precision pin connectors are ideally suited for use in automated assembly. The contact pin is positioned and checked with the utmost care. Our dimensionally stable pin headers thus assure you of a seamless THR process without downtimes.
For particularly fast and stable fixing to the circuit board, you no longer need any additional screws. With our solder flanges, you solder the connection components to the contact pins in a single step in the reflow process. Time-consuming steps involving screws are no longer required. In addition, the geometry and positioning of the solder flange protects the solder joints against long-term mechanical stress and prevents them from being put under strain when screws are tightened.
Reduce the number of items, the time spent on data administration, and the storage space required to a minimum. Thanks to their modular structure, our SL-SMarT pin headers with THR solder connections can be combined using any number of two- and three-pin components. Since you only need two conveyor systems, you optimize use of the available feeder space. Especially for circuit boards with different, multi-pole pin headers, the processing rate and cost optimization achieved with the SL-SMarT are unrivaled.
In the SMT process, the surface-mounted devices (SMDs) are soldered to the PCB with solder pads. The use of SMD components means that it is possible to dispense with wire pins to the components and with the holes normally required for attachment to the PCB.
To maximize dimensional stability and ensure accurate grid alignment, we make our SMD components from the high-performance plastic LCP. This material offers high dimensional stability and excellent solder heat resistance. Our SMD connection system thus ensures a reliable, smooth SMD process. With their low moisture sensitivity level (MSL 1), you can process our components without pre-drying. Their low thermal expansion coefficient also prevents an assembly from being deflected during the soldering process, thus speeding up your fully automated assembly process.
Our LSF-SMD PCB terminals guarantee a secure hold on the circuit board thanks to the use of two solder pads per pole—even without additional mounting flanges. Holding forces per pin of over 150 N in an axial direction withstand even heavy loading. Simulated endurance tests confirm the high vibration and shock resistance of our products according to IEC 61373/10.2011, assuring you of a smooth and maintenance-free SMT process over the long term. Even secure integration on composite boards made of glass, ceramics, or aluminum is unproblematic.
Our components with pick-and-place pads and suction surfaces support secure mounting and precise placement in fully automated assembly. With their light weight, our SMD-optimized PCB terminals also maximize assembly performance. You benefit from simple integration of the connection elements in the assembly process with tape-on-reel packaging in standard conveyor widths. They are designed for automation and contain a very high number of components per roll. This reduces your setup costs in automated SMD processes.
To ensure reliable soldering quality in the manufacturing process, the contact surfaces of solder pins must be wetted with the solder paste immediately after assembly. This allows the flux contained within the paste to react with the Sn coating, resulting in a reliable soldering quality. The LSF-SMD has a coplanarity of up to 100 μm. We recommend a stencil thickness of 150 to 200 μm.
Stability properties are covered by normative values as well as additional practical testing. The axial torque per contact point (pole) is significantly higher than the values permitted by the standard IEC 60947-7-4. A clamping force per pole of around 150 N (40 N limit value for 1.5 mm² conductor cross-sections) in the axial direction is many times higher than the normative requirements.
A simulated service life test is performed. The test spectrum includes increased broadband noise and shock in accordance with IEC 61373/10.2011 with a category 1B severity level (“body mounted”) in the 5-to-150-Hz frequency range and with an ASD level of 1.857 (m/s²)²/Hz 3 dB and an effective acceleration of 5.72 m/s² and 240 degrees of freedom (DOF). The test duration is five hours per axis. The half-sine shock wave form has a peak acceleration of 50 m/s² and a nominal duration of 30 ms.
Besides the Standard-Box packaging, Weidmüller offers tape-on-reel, tray and tube packaging for machine compatible and product-specific packaging of components.
For automatic assembly, the male headers are available for 90° (angles) - and 180° (straight) versions in “tape-on-reel” technology. These are developed precisely for the respective product in compliance with IEC 602586-3. The reels are anti-static, have a diameter of 330 mm (specific details are found in the data sheet) and are adapted to commercially available feeders.
The tape is covered with protective foil. A high temperature resistant "pick-and-place pad" is centered on the male header for automatic gripping of the straight male headers (180°). This "pick-and-place pad" included in the delivery package of the males headers in the "tape-on-reel" mode of delivery. The angled male headers (90°) are designed such that no "pick-and-place pad" is required for automatic gripping.
The width of the tape-on-reel is influenced by the pitch size (L1), the number of poles and the side edge (O=open, F=flange, SF=solder flange, LS=lock solder flange). For the universal tapes used, Weidmüller offers the tape-on-reel widths: 32 mm, 44 mm, 56 mm, and 88 mm.
You find packaging information (e.g. packaging type, quantity, reel diameter) in the respective data sheet of the selected product and on the product level of the Weidmüller product catalog .
Our components (THR and SMD) are made of glass fiber reinforced LCP (Liquid Crystal Polymer). This guarantees a high level of shape stability. The positive temperature properties of the material and the in-built pitch space (stand-off) of min. 0.3 mm make it ideally suited for the solder paste process.
For data push-in connectors (RJ45 and USB sockets), besides LCP, also PA9T and PA10T are used which also have a low Moisture Sensitivity Level (MSL 1).
Plug-in connector systems are exposed to many external influences, such as damp heat and vibration which have a negative effect on the electrical and mechanical properties and can thus reduce the service life of the device. In order to combat this wear, our plug-in connector components are provided with an effective contact coating and are tested in the lab for long service life under an industrial atmosphere. The typical contact layer structure has a copper alloy as base material, nickel as barrier layer, and zinc or gold as the contact layer.
Detailed information on the materials and surfaces are contained on the product catalog and in the data sheet.
No less essential in the SMT production process is reflow soldering: In this step, an existing solder deposit is melted, whereby around 50 percent of the paste volume vaporizes. After the PCB is assembled, a drop forms on the pin tip: it is melted in the reflow profile, flows by capillary action into the drill hole and forms the solder meniscus.
PCB and components are gently heated in the preheating phase. This "activates" the solder paste in parallel. During the period above the fusion temperature (217°C to 221°C), the solder is liquefied and connects the components to terminals on the board. The maximum temperature of 245°C to 254°C is maintained for approximately ten to 40 seconds. The solder hardens during the cooling phase. The PCB and components should not be allowed to cool too quickly, however, to prevent stress cracks in the solder.
The recommended solder profiles for reflow and wave soldering are contained in the product catalog and the data sheet of the respective components.
The required paste volume and therefore the degree of filling of solder paste in the past printing process are essential for an optimal soldering result in the SMT process.
For THR solder points—in comparison to the wave soldering—a slightly larger mounting hole diameter is recommended because the fusion of the paste requires sufficient space in the drilled hole.
Read more about the PCB and stencil design in the white paper Surface Mount Technology: integration of device connection technology in the SMT process